ePAK eFOSB (Front Opening Shipping Box)
Front Opening Shipping Box / 300mm

FOSB 300mm Wafer Carrier

A FOSB (Front Opening Shipping Box) is the semiconductor industry standard for shipping 300mm wafers between fabs. The ePAK eFOSB 300-A is a SEMI/FIMS-compliant FOSB with 25 slots, pre-installed purge valves, and full AMHS compatibility for secure inter-fab wafer transport.

25 Wafer Slots
4.9 kg Empty Weight
10 mm Wafer Pitch
300 mm Wafer Size
  • SEMI/FIMS Compliant
    Direct interface with standard load ports and AMHS systems
  • Pre-Installed Purge Valves
    Nitrogen purge capability with the front door closed
  • ESD-Safe Robotic Flange
    Carbon fiber filled PC flange with 10⁴–10⁷ ohms/sq surface resistivity
  • Door-On Cleaning
    Full cleaning cycle without disassembly of the door
  • Low Outgassing Materials
    Ultrapure construction protects wafers from volatile compound contamination
  • Modular Configuration
    10 order variants with filter, D-Ring, and info tag options
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eFOSB 300-A Overview

Product walkthrough covering key features, door mechanism, and purge valve operation

ePAK eFOSB (Front Opening Shipping Box)
ePAK eFOSB (Front Opening Shipping Box)

FOSB: Reliable 300mm Wafer Transport Between Fabs

The ePAK eFOSB 300-A is a 300mm FOSB wafer carrier purpose-built for silicon wafer transportation between fabrication facilities. With 25 slots at 10mm pitch, pre-installed purge valves, and SEMI/FIMS compliance, this FOSB provides controlled protection from fab to fab.

Semiconductor manufacturing demands absolute wafer integrity during every stage of transport. The eFOSB 300-A, one of ePAK’s FOSB semiconductor solutions for inter-fab wafer logistics, addresses this requirement as a purpose-engineered wafer shipping container with robust mechanical design and ultrapure, low-outgassing material construction. Each unit holds 25 silicon wafers at a consistent 10mm pitch with ±0.5mm non-cumulative spacing accuracy, conforming to SEMI specifications for reliable automated retrieval.

As a 300mm wafer shipping box, the eFOSB 300-A integrates directly with automated material handling systems through its top-mounted robotic flange and kinematic coupling features. The robotic flange is molded from eM-157, a carbon fiber filled polycarbonate achieving 10⁴ to 10⁷ ohms/sq surface resistivity per ASTM D-257. Pre-installed purge valves allow nitrogen flushing while the front door remains closed, protecting wafer surfaces from moisture and airborne molecular contamination during transit.

The SEMI-compliant FOSB supports both automated and manual operation, with a door that cleans without disassembly. Unlike standard wafer handling boxes or cassettes, the eFOSB 300-A provides full enclosure and nitrogen purge capability for protected long-distance transport. ePAK offers multiple standard configurations with options for particle filters, D-Ring attachments, info tag plates, and finish types, and tailors custom configurations to match specific facility requirements. Units are available for immediate shipment, supporting rapid wafer delivery without extended lead times.

Looking for in-fab wafer handling instead of inter-fab shipping? Compare FOSB vs FOUP carriers to find the right solution for your process.

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Typical Applications

Where the FOSB fits in your semiconductor supply chain

Inter-Fab Wafer Shipping

Inter-Fab Wafer Shipping

Secure transport of 300mm wafers between fabrication facilities, including long-distance and international shipments with nitrogen purge protection.

Test and Inspection

Test and Inspection

Safe delivery of wafers to off-site or third-party testing and inspection facilities while maintaining contamination-free conditions.

Assembly and Packaging

Assembly and Packaging

Reliable wafer transport from front-end fabrication to back-end assembly and packaging operations across different geographic sites.

AMHS Automation

AMHS Automation

Full compatibility with automated material handling systems, overhead hoist transport, and automated guided vehicles for lights-out logistics.

ESD-Safe Robotic Flange

ESD-Safe Robotic Flange

Carbon fiber filled PC flange (eM-157) with 10⁴–10⁷ ohms/sq surface resistivity protects wafers from electrostatic discharge during automated handling.

Door-On Cleaning

Door-On Cleaning

Front-opening door with SEMI-compliant latch key interface supports automated and manual cycles. Full cleaning without door disassembly.

Compatibility & Integration

Standards compliance and equipment interoperability for the eFOSB 300-A

Industry Standards

  • SEMI/FIMS Compliant
  • SEMI Kinematic Coupling
  • Wafer Position Reference Plane
  • SEMI Door Latch Interface
  • Registration Pin Interface
  • Hold Down Mechanism
  • ASTM D-257 (ESD Testing)
  • ISO 9001:2015 Manufactured
  • RoHS Compliant

Equipment Compatibility

  • Standard 300mm Load Ports
  • OHT Overhead Transport
  • AGV Guided Vehicles
  • Manual FOSB Openers
  • Nitrogen Purge Systems
  • AMR Mobile Robots

Accessories & Packaging

  • Moisture Barrier Bags
  • ESD Protective Bags
  • EPE Cushion Bags
  • Manual Handle Pair
  • Top Robotic Flange
  • Info Tag Plate
  • D-Ring Attachment

Specifications

Comprehensive technical specifications and ordering information. All data meets current SEMI standards for wafer processing.

eFOSB Technical Specifications
Wafer Size 300 mm (12")
Capacity 25 slots
Wafer Pitch 10 mm
Pitch Tolerance ±0.5 mm (non-cumulative)
First Wafer Position 44.00 mm (D1)
Last Wafer Position 284.00 mm (D25)
Empty Weight 4.9 kg
Loaded Weight ~8.1 kg (25 wafers)
Shell Material Ultrapure, low outgassing polymer
Flange Material eM-157: Carbon fiber filled PC (static dissipative)
Handle Material eM-175
Physical Dimensions
Width (with handles) 394.4 mm (A1)
Length 340.0 mm (L)
Height 333.0 mm (B)
Height (shell only) 337.3 mm (B1)
Shell Width 330.0 ±1.0 mm (z47)
Cover Height 166.2 ±0.5 mm (y52)
Flange Height 142.0 ±1.0 mm (y46)
General Tolerance X.X = ±2.0 mm; X.XX = ±0.50 mm
Datum Reference Per SEMI kinematic coupling specification

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Frequently Asked Questions

Common questions about FOSB wafer shipping boxes

Technical Documentation

Need technical specifications for your project? Technical drawings, datasheets, and 3D models are available upon request.

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