eFOSB Wafer Handling

Introduction to Enhanced Wafer Handling with ePAK’s Front Opening Shipping Box (eFOSB)

The ePAK eFOSB (Front Opening Shipping Box) enhances 300mm wafer handling and shipping for semiconductor manufacturing. Compliant with SEMI/FIMS and AMHS standards, this FOSB ensures superior protection during transport and storage. The eFOSB features a 25-slot capacity for 300mm wafers with precision spacing, automated operations, and a manual handling option. Crafted from ultra-clean, low-outgassing materials with a robust wafer retention system, it minimizes contamination risks and particle generation, preserving wafer integrity. This FOSB offers immediate availability, streamlined production, and customization options, making it ideal for semiconductor manufacturers seeking to optimize their wafer handling and shipping processes.

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Overview of eFOSB Technology

Key Features of eFOSB Technology:

SEMI/FIMS compliant
AMHS compliant
Automated operation minimizes potential contamination from human interaction
Automation & manual compatibility for opening and closing
Ultrapure, low outgassing materials protect wafers
Robust wafer retention ensures reduced particle generation
The eFOSB features a 25-slot capacity for 300mm wafers with precision spacing, automated operations, and a manual handling option. FOSB semiconductor solutions are essential for the safe transportation and storage of delicate semiconductor wafers, driven by advancements in technology and the increasing complexity of semiconductor devices.

eFOSB Specifications

Wafer size – 300mm
Capacity – 25 slot
All datums established relative to kinematic coupling per SEMI
Wafer spacing – 10mm (+/-0.5mm wafer-to-wafer, non-cumulative)
Weight (empty) – 4.9 kg; 25 wafer loaded in, about 8.1kg
Overall size w/ handles and robotic flange : W395 X L340 X H338(mm)
Overall size w/o handles and robotic flange : W388 X L340 X H333(mm)

eFOSB 300-A Interoperability

eFOSB Shell Interface Features:

Kinematic coupling features
Alignment
Wafer position reference plane
Hold down feature
Load port pulls down on feature to hold eFOSB

eFOSB Door Interface Features:

Registration pin holes
Alignment
Latch key holes
Allows door to be mechanically latched and unlatched

Strategic Advantages

Readiness and Competitive Benefits

Immediate Availability: eFOSB units are ready for immediate shipment, supporting rapid deployment to accelerate your manufacturing capabilities without delay.

Streamlined Production and Supply Chain: Leveraging advanced manufacturing technologies and robust supply chain logistics, ePAK ensures that eFOSB can be produced and delivered swiftly. Our operations are designed to respond dynamically to both market fluctuations and specific client requirements.

Customization for Precision Fit: eFOSB can be tailored to meet specific operational needs, offering flexible solutions that reduce downtime, minimize maintenance costs, and enhance wafer protection.

Frequently asked questions

What is FOSB?

FOSB stands for Front Opening Shipping Box. It is a crucial component in the semiconductor industry, widely used for the safe handling and transportation of semiconductor devices. FOSBs ensure cleanliness and prevent damage to wafers as they are transferred between manufacturing plants and factories. They are designed to prevent damage and contamination during the shipping and handling process, maintaining the quality and integrity of semiconductor devices.

What are the applications for a FOSB?

Secure wafer handling and transportation
Clean and contamination-free wafer handling
Reliable automation interface and interoperability in semiconductor manufacturing
Long-distance shipping of wafers between facilities
Temporary storage of wafers in cleanroom environments

What is the difference between FOUP (Front Opening Unified Pod) and a FOSB (Front Opening Shipping Box)?

While both are used in wafer transport, FOUPs are primarily used for internal transport and manufacturing processes within a semiconductor facility. FOSBs, on the other hand, are specifically designed for shipping and external transport of wafers between different locations or facilities.

How many wafers can a FOSB hold?

The eFOSB 300-A model has a capacity of 25 slots, designed for 300mm wafers.

What is the difference between FOSB and SMIF pods?

FOSB (Front Opening Shipping Box) and SMIF (Standard Mechanical Interface) pods are both used in semiconductor manufacturing, but they serve different purposes:

FOSBs are designed for long-distance shipping and external transport of wafers.
SMIF pods are typically used for short-distance transport within a cleanroom or between closely located tools.
FOSBs usually have a larger capacity and more robust construction for shipping purposes.
SMIF pods are generally smaller and designed for quick, easy access in cleanroom environments.

What are the key features of ePAK's eFOSB?

SEMI/FIMS and AMHS compliant
Automated operation to minimize contamination
Compatible with both automated and manual handling
Constructed from ultrapure, low outgassing materials
Robust wafer retention system for reduced particle generation
Precision wafer spacing of 10mm (+/-0.5mm wafer-to-wafer, non-cumulative)

What are the dimensions and weight specifications of the eFOSB?

Overall size with handles and robotic flange: 395mm (W) x 340mm (L) x 338mm (H)
Overall size without handles and robotic flange: 388mm (W) x 340mm (L) x 333mm (H)
Weight (empty): 4.9 kg
Weight (loaded with 25 wafers): approximately 8.1 kg

How does the eFOSB ensure wafer protection during transport?

The eFOSB utilizes ultrapure, low outgassing materials and a robust wafer retention system to protect wafers from contamination and physical damage. Its design minimizes particle generation and maintains precise wafer spacing to prevent contact between wafers during transport.

Can the eFOSB be customized for specific operational needs?

Yes, ePAK offers customization options for the eFOSB to meet specific operational requirements, helping to reduce downtime, minimize maintenance costs, and enhance wafer protection.

What are the advantages of using ePAK's eFOSB?

Immediate availability for rapid deployment
Streamlined production and supply chain for swift delivery
Customization options for a precise fit to operational needs
SEMI/FIMS and AMHS compliance for seamless integration
Advanced design for superior wafer protection and contamination control

Wafer Shipping & Handling Catalog

Our catalog covers a wide range of products specifically tailored to handling your wafers. Please contact us if you need custom solutions to your projects.

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